Apple and Intel Sign Chip Making Deal for MacBook Neos
Intelligence report synthesized for precision. Verified source updates below.
Detailed Report
Apple and Intel have reportedly entered a preliminary chipmaking agreement that could see Intel manufacture chips for future Apple devices.
According to a report citing people familiar with the matter, the two companies have been engaged in discussions for more than a year and finalized a formal agreement in recent months.
While no specific chip was officially named in the reported deal, sources suggest the agreement could involve Apple’s next-generation A21 chips as well as MacBook Neo chips.
Apple currently relies on TSMC’s N3B process technology to manufacture its A18 chips, which are reportedly used in the MacBook Neo lineup and the iPhone 16 series.
The report said increasing demand for MacBook Neo devices, combined with broader chip shortages linked to AI infrastructure growth, has pushed Apple to diversify its production strategy.
Apple recently increased MacBook Neo prices by $100, moving away from the product’s previous $599 starting position.
The company is reportedly seeking additional manufacturing capacity as AI-related demand continues to pressure chip supplies across the industry.
The agreement could help Apple secure additional supply for its entry-level and mainstream-focused chips while easing dependence on TSMC production capacity.
Intel recently introduced its Core Series 3 processors, codenamed Wildcat Lake, which compete in the same market segment as the MacBook Neo lineup.
The processors use Intel’s 18A process technology. The report did not specify which Intel node Apple could use for future chips, although 18A-P and 14A were mentioned as possible candidates.
The report also noted that Apple previously explored manufacturing discussions with both Intel and Samsung Electronics, suggesting the company may continue seeking additional partners if more capacity is required.
For Intel, the reported agreement could strengthen confidence in its foundry business as the company continues expanding technologies such as 18A-P, 14A, and EMIB packaging.
